BMW Report Research Paper Example | Topics and Well Written Essays - 1750 words

BMW Report - Research Paper Example The plant, property and equipment for the company amounted to â‚ ¬ 11,685 million and â‚ ¬ 11,427 million in the years 2011 and 2010 respectively. The depreciation expenses that have been charged on the property, plant and equipment of the company amounted to â‚ ¬ 2,324 million in the year 2011. The depreciation expenses have increased by â‚ ¬ 23 million from the 2010 figure which was â‚ ¬ 2,301 million (BMW Group, 2012, p.57). If we look at the cash flow statement of the BMW group as presented in its recent annual report for the year 2011, the following details could be found regarding the depreciation expenses, sales and purchase of property by the company and gains from the sale of property and equipment by the company for the year 2011: Depreciation and amortization of other intangible, tangible and investment assets amounted to â‚ ¬ 3,654 million. There was no gain / loss of tangible and intangible assets and marketable securities as observed in the cash flow statement. Investment in intangible assets and property, plant and equipment amounted to â‚ ¬ 3,679 million. Proceeds from the disposal of intangible assets and property, plant and equipment amounted to â‚ ¬ 53 million. The ratio of capital expenditure of the company to its generated revenues for the year 2011 was 5.4%. This figure remained unchanged from the previous year figure (BMW Group, 2012, p.19).

ELECTRONIC PACKAGING AND ASSEMBLY Lab Report Example | Topics and Well Written Essays - 1750 words

ELECTRONIC PACKAGING AND ASSEMBLY - Lab Report Example The figure below shows the High Performance Lead Frame Electronic Package. I selected the concept on the basis of its power management applications in the electronics engineering field. The leads in the extended area of the design increase current competence leading to required power rating. The electronic applications in the recent years find a reduction of per transistor power rate along with higher current and power rating accompanied by better performance and speed constraints. The lead frame technology keeps these requirements to much efficient position. I have analyzed the various design considerations made in the electronics packaging sector in order to determine the actual and worth design for the potential package of electronic modules. It is known to all that the electronic package is not just outer coverings of component or assembly of components but the substrate, interconnections and covering are also included in it. The lead frame was made which comprises of a layer of conductor of electricity, a die paddle and a plurality of leads which are remote from each other and are partly bare at the base of the package. This provides a platform for fitting various components of the circuit to be built. The semiconductor chips include the bond pads which are mounted on the die plane interconnected by the wires between them and plurality of leads. There exists a minimum of two wires connected between a minimum of two bond pads and a plurality of leads with single lead. Each single lead has an extended portion required for higher perfo rmance. My study of the electronic packaging techniques revealed that they have flourished from the primitive blown and shaped slip metal packaging to the trail assemblage in print. The electronics field determines the packaging as a significant area of engineering. The overall performance of a circuit assembly can be increased by utilizing